Vertically stacked, low-voltage organic ternary logic circuits including nonvolatile floating-gate memory transistors – SemiEngineering

Researchers demonstrate “a low-voltage organic ternary logic circuit, in which the organic HTR was vertically integrated with the organic nonvolatile flash memory.”
Research paper from KAIST and Gachon University.
Abstract
“Multi-valued logic (MVL) circuits based on heterojunction transistor (HTR) have emerged as an effective strategy for high-density information processing without increasing the circuit complexity. Herein, an organic ternary logic inverter (T-inverter) is demonstrated, where a nonvolatile floating-gate flash memory is employed to control the channel conductance systematically, thus realizing the stabilized T-inverter operation. The 3-dimensional (3D) T-inverter is fabricated in a vertically stacked form based on all-dry processes, which enables the high-density integration with high device uniformity. In the flash memory, ultrathin polymer dielectrics are utilized to reduce the programming/erasing voltage as well as operating voltage. With the optimum programming state, the 3D T-inverter fulfills all the important requirements such as full-swing operation, optimum intermediate logic value (~VDD/2), high DC gain exceeding 20 V/V as well as low-voltage operation (<5 V). The organic flash memory exhibits long retention characteristics (current change less than 10% after 104 s), leading to the long-term stability of the 3D T-inverter. We believe the 3D T-inverter employing flash memory developed in this study can provide a useful insight to achieve high-performance MVL circuits.”
Find the open access technical paper here.  Published April 2022.
Choi, J., Lee, C., Lee, C. et al. Vertically stacked, low-voltage organic ternary logic circuits including nonvolatile floating-gate memory transistors. Nat Commun 13, 2305 (2022). https://doi.org/10.1038/s41467-022-29756-w
Visit Semiconductor Engineering’s Technical Paper library here and discover many more chip industry academic papers.


(Note: This name will be displayed publicly)

(This will not be displayed publicly)



Disaggregation and the wind-down of Moore’s Law have changed everything.
Different interconnect standards and packaging options being readied for mass chiplet adoption.
Smart software finds more EUV stochastic defects and missing vias, improving wafer yield.
Equipment companies and new battery chemistries among 132 startups that raised $3B.
Continued expansion in new and existing markets points to massive and sustained growth.
Interest in this particular ISA is expanding, but the growth of other open-source hardware is less certain.
Nanosheets are likeliest option throughout this decade, with CFETs and other exotic structures possible after that.
Hybrid bonding opens up whole new level of performance in packaging, but it’s not the only improvement.
Is there room for an even smaller version of a RISC-V processor that could replace 8-bit microcontrollers?
Why this is becoming a bigger issue, and what can be done to mitigate the effects.
Some 300mm tools are converted to 200mm; equipment prices and chip manufacturing costs are rising.
How much do we pay for a system to be programmable? It depends upon who you ask.
From low resistance vias to buried power rails, it takes multiple strategies to usher in 2nm chips.

source